Edge cracking and high surface roughness during turning/drilling.
Use diamond or CBN cutting tools for low-speed cutting (<50m/min).
Adopting ultrasonic vibration assisted machining (reducing cutting force).
Annealing (1000 ° C/1h) after processing to relieve stress.
After processing, the surface turns black (MoO3 oxide layer).
Use cutting fluid for cooling during processing.
Acid washing (HF+HNO ∝ mixture) to remove the oxide layer.
Store in an inert atmosphere (such as Ar) or vacuum packaging.
Cracks appear on the electrode during rapid cooling and heating.
Avoid rapid heating/cooling (recommended heating rate<10 ° C/min).
Adopting a stepped heating method (such as preheating to 500 ° C and then raising to the target temperature).
